
Jinglei
YANG
楊晶磊
Professor Jinglei Yang obtained his Bachelor and Master degrees from University of Science and Technology of China in 1999 and 2002, respectively, and Ph.D. degree from the Institute for Composite Materials at Technical University of Kaiserslautern, Germany in 2006. He was a PostDoc Research Associate in Beckman Institute at University of Illinois at Urbana-Champaign from 2006 to 2008. He joined Nanyang Technological University (NTU) as an Assistant Professor from 2008 to 2016. He received the Wilfried Ensinger Award supported by the Scientific Alliance of the University Professors of Polymer Technology (WAK) Germany (2008), Koh Boon Hwee Scholars Inspirational Teaching Award from NTU (2013), and Distinguished Young Investigator of China Frontiers of Engineering Award from Chinese Academy of Engineering (2019). He was included in the top 1% list of global materials scientists assessed by standardized citation metrics (2020) and named a Fellow of the Royal Aeronautical Society (2021) and the Royal Society of Chemistry (2021). Professor Yang’s research aims at tackling engineering problems via materials innovation, which interfaces cross-disciplinary areas ranging from chemistry, materials engineering, manufacturing to mechanics. He has extensive fundamental and applied research experiences in his field and completed or has been leading more than 30 projects supported by government and industrial partners since 2009 in microencapsulation, self-healing materials, self-cleaning nanocoatings, energy-efficient materials, and multifunctional composites, and smart manufacturing, etc. His current research interests include using data-driven materials genome approach to design and manufacture bioinspired multifunctional composites and structures to address the challenging issues in aerospace, building, and transportation (including aerospace) sectors. He has been an editorial board member or associate editor of Composites Communications, Plastics, Rubber and Composites, Functional Composites and Structures, and Journal of Micromechanics and Molecular Physics, etc.